ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME
Dossier Overview
Applicant
STATS ChipPAC Pte. Ltd.
Inventor
JinHee JUNG; HeeSoo LEE; EunHee MYUNG
IPC Classification
CPC Classification
A method for forming an electronic device is provided. The method comprises: providing a light pervious carrier having on its front surface an auxiliary layer; forming conductive patterns on the auxiliary layer; disposing at least one electronic component on at least a portion of the conductive patterns via solder bumps; exposing the auxiliary layer to a light source through the light pervious carrier to heat the auxiliary layer and reflow the solder bumps; forming a mold cap on the auxiliary layer to encapsulate the conductive patterns and the at least one electronic component to form the electronic device; and removing the auxiliary layer and the light pervious carrier from the electronic device to expose the conductive patterns.
Original (Chinese)
A method for forming an electronic device is provided. The method comprises: providing a light pervious carrier having on its front surface an auxiliary layer; forming conductive patterns on the auxiliary layer; disposing at least one electronic component on at least a portion of the conductive patterns via solder bumps; exposing the auxiliary layer to a light source through the light pervious carrier to heat the auxiliary layer and reflow the solder bumps; forming a mold cap on the auxiliary layer to encapsulate the conductive patterns and the at least one electronic component to form the electronic device; and removing the auxiliary layer and the light pervious carrier from the electronic device to expose the conductive patterns.
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