SIGNAL AND/OR POWER ROUTING USING AT LEAST ONE INTERCONNECTION INTERPOSER IN A DIE STACK WITH AT LEAST ONE PASSIVE PASS-THROUGH DIE
Dossier Overview
Applicant
ATI Technologies ULC
Inventor
Tyrone HUANG; Wonjun JUNG; Yaser Azeez MOHAMMED
IPC Classification
CPC Classification
An integrated circuit (IC) die stack is disclosed that routes signals and/or power around at least one active base die to die(s) above the at least one base die by using an interconnection interposer and at least one passive pass-through die. Through-silicon vias (TSV) and bond-pad vias (BPV) in the interconnection interposer and passive pass-through die(s) are used for signal connections between the base die, die(s) stacked above the base die and IC die stack substrate. Integration of complex electronic systems on a chip (SoC) can be inexpensively and quickly created using state of the art, off-the-shelf and unmodified IC devices.
Original (Chinese)
An integrated circuit (IC) die stack is disclosed that routes signals and/or power around at least one active base die to die(s) above the at least one base die by using an interconnection interposer and at least one passive pass-through die. Through-silicon vias (TSV) and bond-pad vias (BPV) in the interconnection interposer and passive pass-through die(s) are used for signal connections between the base die, die(s) stacked above the base die and IC die stack substrate. Integration of complex electronic systems on a chip (SoC) can be inexpensively and quickly created using state of the art, off-the-shelf and unmodified IC devices.
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