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案件記録
DESIGN AND STRUCTURES OF HIGH-SPEED INTERCONNECTS FOR IMPROVED SIGNAL INTEGRITY
発明審査中
20請求項 · 2 独立
§ Ⅰ
案件概要
発明者
Guoan Wang; Yingcong Zhang
IPC分類
H1P 3/8H1P 5/18H1P 11/H3H 7/1
CPC分類
H1P3/81H1P5/185H1P11/3H3H7/1791
An improved design methodology and new interconnect structures, which includes integrating interdigital trapezoidal tabs and defected microstrip line to effectively reduce far-end crosstalk including a new design method and unique structures aimed at enhancing signal integrity.
原文(中国語)
An improved design methodology and new interconnect structures, which includes integrating interdigital trapezoidal tabs and defected microstrip line to effectively reduce far-end crosstalk including a new design method and unique structures aimed at enhancing signal integrity.
外部リソース