CIRCUIT ASSEMBLY
Dossier Overview
Applicant
AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor
Koushi IGURA; Hiroki SHIMODA; Taiji YANAGIDA
IPC Classification
CPC Classification
A circuit assembly that can reduce stress generated at an interface between a heat conducting member and a case is disclosed. A circuit assemblyincludes: heat generating componentsa bus barconnected to connector portionsof the heat generating componentsa casethat houses the heat generating componentsand the bus barand a heat conducting memberthat is placed on a mounted surfaceof the caseis in thermal contact with the caseand the bus barand is sandwiched therebetween. The caseincludes a displacement restricting portionthat engages with a heat conductive memberand restricts displacement of the heat conducting member
Original (Chinese)
A circuit assembly that can reduce stress generated at an interface between a heat conducting member and a case is disclosed. A circuit assemblyincludes: heat generating componentsa bus barconnected to connector portionsof the heat generating componentsa casethat houses the heat generating componentsand the bus barand a heat conducting memberthat is placed on a mounted surfaceof the caseis in thermal contact with the caseand the bus barand is sandwiched therebetween. The caseincludes a displacement restricting portionthat engages with a heat conductive memberand restricts displacement of the heat conducting member
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