COOLING SYSTEMS AND METHODS OF OPERATING THE SAME
Dossier Overview
Applicant
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor
Chung-Chiu WU; Wei-Sheng LIN
IPC Classification
CPC Classification
An embodiment two-phase cooling system includes an enclosure having a first volume and a second volume, a heat source located in the first volume, and a liquid coolant located in the first volume such that the liquid coolant is in contact with the heat source. A vapor partially filling the second volume is generated by the liquid coolant when heat generated by the heat source is absorbed by the liquid coolant. A condenser located in the second volume removes heat from the vapor, thereby condensing the vapor into condensed liquid coolant that returns to the first volume. A space-filling device, located in the second volume, partially fills the second volume, and thereby displaces the vapor from a portion of the second volume. The space-filling device increases a height of the vapor such that an overlap between the vapor and the condenser is increased, thereby increasing a condenser efficiency.
Original (Chinese)
An embodiment two-phase cooling system includes an enclosure having a first volume and a second volume, a heat source located in the first volume, and a liquid coolant located in the first volume such that the liquid coolant is in contact with the heat source. A vapor partially filling the second volume is generated by the liquid coolant when heat generated by the heat source is absorbed by the liquid coolant. A condenser located in the second volume removes heat from the vapor, thereby condensing the vapor into condensed liquid coolant that returns to the first volume. A space-filling device, located in the second volume, partially fills the second volume, and thereby displaces the vapor from a portion of the second volume. The space-filling device increases a height of the vapor such that an overlap between the vapor and the condenser is increased, thereby increasing a condenser efficiency.
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