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Dossier

GATE-ALL-AROUND DEVICES

InventionPending
20Claims · 3 independent
§ Ⅰ

Dossier Overview

Inventor

Mu-Chieh Chang; Wen-Kai Lin; Che-Hao Chang; Tai-Chun Huang; Wei-Yang Lee

IPC Classification

H1L 29/66H1L 29/6H1L 29/417H1L 29/423H1L 29/775H1L 29/786

CPC Classification

H10D30/14H10D30/43H10D62/116H10D64/17H10D64/258H10D30/6735H10D30/6757H10D62/121

A method of the present disclosure includes forming a stack including channel layers interleaved by sacrificial layers, patterning the stack to form a fin-shaped structure, forming an isolation feature, forming a dummy gate stack over a channel region of the fin-shaped structure, depositing a gate spacer layer over the dummy gate stack, recessing a source/drain region of the fin-shaped structure, selectively removing the sacrificial layers to release the channel layers channel members, depositing a dummy layer over the channel members, selectively and partially recessing the dummy layer to form inner spacer recesses, depositing a first inner spacer layer and a second inner spacer layer over the inner spacer recesses, etching back the first inner spacer layer and the second inner spacer layer to form inner spacer features, forming a source/drain feature, removing the dummy layer, and forming a gate structure to wrap around each of the plurality of channel members.

Original (Chinese)

A method of the present disclosure includes forming a stack including channel layers interleaved by sacrificial layers, patterning the stack to form a fin-shaped structure, forming an isolation feature, forming a dummy gate stack over a channel region of the fin-shaped structure, depositing a gate spacer layer over the dummy gate stack, recessing a source/drain region of the fin-shaped structure, selectively removing the sacrificial layers to release the channel layers channel members, depositing a dummy layer over the channel members, selectively and partially recessing the dummy layer to form inner spacer recesses, depositing a first inner spacer layer and a second inner spacer layer over the inner spacer recesses, etching back the first inner spacer layer and the second inner spacer layer to form inner spacer features, forming a source/drain feature, removing the dummy layer, and forming a gate structure to wrap around each of the plurality of channel members.

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