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Power module assembly, motor controller and vehicle

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Source: EPO OPS

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88996629Family
§ Ⅰ

Dossier Overview

Applicant

BYD CO LTD

Application number

CN202210611298

Inventor

LIAN YUBO; LING HEPING; ZHAI ZHEN; LIU HAIJUN; ZHANG HAIXING

Filing Date

May 31, 2022

Publication Date

Aug 7, 2026

Patent Family ID

88996629

IPC Classification

H01L25/07H10W40/22H10W40/73H10W70/40

The invention discloses a power module assembly, a motor controller and a vehicle, and the power module assembly comprises a chip layer which comprises a substrate and a chip disposed on the substrate; a first heat dissipation part and a second heat dissipation part, wherein the chip layer is arranged between the first heat dissipation part and the second heat dissipation part; wherein one side, deviating from the chip layer, of the first heat dissipation part is suitable for exchanging heat with an external heat dissipation medium to reduce the temperature of the chip layer, and the second heat dissipation part is internally provided with a phase change medium and absorbs heat of the chip layer through phase change. According to the power module assembly designed by the invention, a one-side water cooling mode and a one-side change material heat absorption mode are adopted for heat dissipation of the chip, cooling is rapid, and the cooling effect is obvious.

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