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Cooling device, cooling system and electronic equipment

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Source: EPO OPS

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92806135Family
§ Ⅰ

Dossier Overview

Applicant

HUAWEI TECH CO LTD

Application number

CN202310353948

Inventor

SHE ZHENYU; WANG CHAO; TAN XIANGHUI; YAN TAO

Filing Date

Mar 25, 2023

Publication Date

Sep 27, 2024

Patent Family ID

92806135

IPC Classification

H05K7/20

CPC Classification

H05K7/20H05K7/20309H05K7/20327

The embodiment of the invention provides a cooling device, a cooling system and electronic equipment, relates to the technical field of heat dissipation, and aims to solve the problem of poor heat dissipation effect of a heating element in a compact space. The cooling device comprises a first shell, a second shell and a middle shell, and a plurality of jet flow holes are formed in the middle shell. The first shell and the second shell are located on the two opposite sides of the middle shell respectively, a jet flow cavity is defined by the first shell and the middle shell, and a boiling cavity is defined by the second shell and the middle shell; the jet hole is communicated with the jet cavity and the boiling cavity; the surface, deviating from the middle shell, of the second shell comprises a heating element veneer; the cooling device further comprises a liquid inlet channel and a liquid outlet channel, the liquid inlet channel is communicated with the jet flow cavity, and the liquid outlet channel is communicated with the boiling cavity. The cooling device is used for cooling the heating element.

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