Cooling device, cooling system and electronic equipment
Source: EPO OPS
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Dossier Overview
Application number
CN202310353948
Inventor
SHE ZHENYU; WANG CHAO; TAN XIANGHUI; YAN TAO
Filing Date
Mar 25, 2023
Publication Date
Sep 27, 2024
Patent Family ID
92806135
IPC Classification
CPC Classification
The embodiment of the invention provides a cooling device, a cooling system and electronic equipment, relates to the technical field of heat dissipation, and aims to solve the problem of poor heat dissipation effect of a heating element in a compact space. The cooling device comprises a first shell, a second shell and a middle shell, and a plurality of jet flow holes are formed in the middle shell. The first shell and the second shell are located on the two opposite sides of the middle shell respectively, a jet flow cavity is defined by the first shell and the middle shell, and a boiling cavity is defined by the second shell and the middle shell; the jet hole is communicated with the jet cavity and the boiling cavity; the surface, deviating from the middle shell, of the second shell comprises a heating element veneer; the cooling device further comprises a liquid inlet channel and a liquid outlet channel, the liquid inlet channel is communicated with the jet flow cavity, and the liquid outlet channel is communicated with the boiling cavity. The cooling device is used for cooling the heating element.
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