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Bendable circuit board and electronic equipment

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92438345Family
§ Ⅰ

Dossier Overview

Applicant

HUAWEI TECH CO LTD

Application number

CN202322948574U

Inventor

CHEN ZHIJUN; ZHOU JIANJUN

Filing Date

Oct 31, 2023

Publication Date

Aug 27, 2024

Patent Family ID

92438345

IPC Classification

H05K1/00H05K1/02

The utility model relates to the technical field of circuit boards, provides a bendable circuit board and electronic equipment, and can solve the problem that a bendable circuit board and a connected circuit board integrally occupy a large space in related technologies. The bendable circuit board comprises a first daughter board and a second daughter board which are stacked, and the first daughter board is a flexible circuit board; in the extending direction of the bendable circuit board, the bendable circuit board comprises connecting sections and a bending section, and the connecting sections are located on the two opposite sides of the bending section respectively. The connecting section on at least one side of the bending section is provided with a first thin area, the thickness of the first thin area is smaller than the sum of the thicknesses of the first sub-board and the second sub-board, the first sub-board is located outside the first thin area, and a part of the second sub-board is located in the first thin area; the bending section is provided with a second thin area, the thickness of the second thin area is smaller than the sum of the thickness of the first sub-board and the thickness of the second sub-board, a part of the first sub-board is located in the second thin area, and the second sub-board is located outside the second thin area. The method can be applied to electronic equipment such as a mobile phone.

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