半导体封装件及其制法
一种半导体封装件及其制法,包括于中介体的相对两侧分别形成有第一线路部与第二线路部,进而形成中介结构,再将半导体元件封装于该第二线路部上,以通过该第一线路部及第二线路部平衡该中介结构的应力,避免该半导体封装件发生翘曲的问题。
APPLICANTS
Browse source applicant names and unchanged name fields from imported patent records.
These are name-based results, not verified legal entities. Identical names may refer to different people or organizations; aliases and historical names are not merged.
This name was extracted from a distinct applicant node in the source XML.
2 indexed patent records
Patent counts refer to distinct records held by this site, not an applicant’s complete portfolio. A joint name field is not a single company.
Verified corpus date coverage and last import time are not currently available. Publication dates on patent records are not import dates. Cached directory results may lag behind new imports.
Search the local original applicant field containing this full text. Results may include joint lists or longer names; this is not an exact identity search.
Search patents with this applicant condition