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中介结构及其制法
InventionUnknown
10Claims · 2 independent
§ Ⅰ
Dossier Overview
Inventor
倪庆羽; 陈伟铭
Filing Date
Apr 11, 2025
Publication Date
Oct 20, 2026
IPC Classification
H10W 20/20 (2026.01)H10W 20/00 (2026.01)H10W 70/65 (2026.01)H10W 70/05 (2026.01)
一种中介结构及其制法，包括于中介体的相对两侧上分别形成有第一线路部与第二线路部，以平衡该中介结构的应力，避免后续应用发生翘曲的问题。
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