一种基于BGA封装的芯片设计方法及IC载板
本发明提供一种基于BGA封装的芯片设计方法及IC载板,其中,第一晶片放置在第二晶片下方并与第二晶片完全重叠;键合指沿扇出方向对齐排布,并与封装芯片的I/O的行列方向保持一致,结合硅晶片的叠放方式、扇出方式及滤波电容的布局方式,优化键合指和电容的布局,在满足芯片的采样率、分辨率及动态范围等技术指标前提下,有效的降低了芯片BGA封装的厚度,增强了芯片的适用性。
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