共用焊盘
本申请提供一种共用焊盘,所述共用焊盘包含:第一安装区,设置于共用焊盘的一侧,第一安装区暴露出复数个第一散热孔;以及第二安装区,设置于共用焊盘背离第一安装区的一侧,第二安装区的暴露出复数个第二散热孔,其中,所述复数个第一散热孔与所述复数个第二散热孔位于第一安装区以及第二安装区的公共区域,且分别被位于第一安装区和第二安装区的防焊材料所覆盖。所述共用焊盘能够减少芯片缺料而印刷电路板布线需重新设计的麻烦。
APPLICANTS
Browse source applicant names and unchanged name fields from imported patent records.
These are name-based results, not verified legal entities. Identical names may refer to different people or organizations; aliases and historical names are not merged.
This page matches the complete original name field. It may contain multiple applicants or another recorded party role. Name boundaries and legal identities have not been verified; punctuation is preserved, not split.
1 indexed patent records
Patent counts refer to distinct records held by this site, not an applicant’s complete portfolio. A joint name field is not a single company.
Verified corpus date coverage and last import time are not currently available. Publication dates on patent records are not import dates. Cached directory results may lag behind new imports.
Search the local original applicant field containing this full text. Results may include joint lists or longer names; this is not an exact identity search.
Search patents with this applicant condition