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一种半导体用无金属烧结助剂堇青石陶瓷体的分段烧结制备方法
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8Claims · 1 independent
§ Ⅰ
Dossier Overview
Inventor
柴杰; 何静; 张积玮; 赖洪岚; 叶明亮
Filing Date
Jul 10, 2026
Publication Date
Oct 16, 2026
IPC Classification
C04B 35/195 (2006.01)C04B 35/622 (2006.01)C04B 35/64 (2006.01)
本发明公开了一种半导体用无金属烧结助剂堇青石陶瓷体的分段烧结制备方法,属于半导体先进制程领域,包括以下步骤:S1,将堇青石粉、润滑剂、分散剂和粘结剂按重量比为95~97:0.5~1:1~3.5:1混合均匀后进行球磨;S2,将球磨后的混合物进行喷雾造粒,得到造粒粉;S3,将造粒粉进行预压成型,得到堇青石素坯;S4,将堇青石素坯进行低温煅烧;S5,高温烧结:以升温速度为5℃/min~10℃/min,升温到1300℃~1400℃时保温3h~6 h;S6,以降温速度为0.5℃/min~1℃/min,降至常温,得到堇青石陶瓷材料。本发明无金属烧结助剂参与,制成的堇青石陶瓷体CTE绝对值可低至8.8。
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