INORGANIC RECONSTITUTION CARRIER PANEL
Dossier Overview
Applicant
Intel Corporation
Inventor
Brandon C. MARIN; Srinivas Venkata Ramanuja PIETAMBARAM; Jeremy D. ECTON; Hiroki TANAKA; Gang DUAN
IPC Classification
CPC Classification
Embodiments disclosed herein include an apparatus that comprises a substrate, where the substrate comprises a glass layer with a first surface, a second surface, and a sidewall surface. In an embodiment, a via is provided through a thickness of the substrate, and a first layer is on the substrate, where the first layer is over the first surface and the sidewall surface of the substrate. In an embodiment, the first layer comprises a first organic dielectric material. In an embodiment, a second layer is spaced apart from the substrate by the first layer, and the second layer comprises a second organic dielectric material. In an embodiment, a die is over the second surface of the substrate, where the die is hybrid bonded to the via.
Original (Chinese)
Embodiments disclosed herein include an apparatus that comprises a substrate, where the substrate comprises a glass layer with a first surface, a second surface, and a sidewall surface. In an embodiment, a via is provided through a thickness of the substrate, and a first layer is on the substrate, where the first layer is over the first surface and the sidewall surface of the substrate. In an embodiment, the first layer comprises a first organic dielectric material. In an embodiment, a second layer is spaced apart from the substrate by the first layer, and the second layer comprises a second organic dielectric material. In an embodiment, a die is over the second surface of the substrate, where the die is hybrid bonded to the via.
External Resources