AUTOMATED MINIMIZATION OF ETCH VARIATIONS BY ADJUSTING ETCH PROCESS BASED ON PATTERN DENSITY

Original (Chinese)

Techniques, structures, and systems related to etch processing using automated selection of etch parameters are discussed. Patterns of features having differing pattern densities are etched into underlying material layers having the same or similar characteristics such as material composition, thickness, etc. While other process parameters remain substantially constant, gas flows, as defined by a gas flow ratio, of etchant gases are automatically selected from available or selectable gas flow ratios using the pattern densities. The ratio of gas flows increases monotonically with increasing pattern density.