METHODS AND SYSTEMS FOR FORMING INTEGRATED CIRCUIT PACKAGES COMPRISING GLASS LAYERS
Dossier Overview
Applicant
Intel Corporation
Inventor
Andrew Matthew Jimenez; Manohar Konchady; Mahdi Mohammadighaleni; Hiroki Tanaka; Ehsan Zamani; Whitney M. Bryks; Haobo Chen; Gang Duan; Benjamin T. Duong; Darko Grujicic; Jung Kyu Han; Thomas S. Heaton; Shayan Kaviani; Brandon Christian Marin; Robert A. May; Seyyed Yahya Mousavi; Bai Nie; Srinivas Venkata Ramanuja Pietambaram; Bohan Shan; Joshua J. Stacey; Elham Tavakoli; Yekan Wang; Zhixin Xie
IPC Classification
CPC Classification
An apparatus comprising a package substrate, the package substrate comprising a glass layer, a first layer comprising a photo-imageable dielectric (PID) material above the glass layer, a second layer below the glass layer, the second layer comprising the PID material, at least one buildup layer above the first layer, and at least one buildup layer below the second layer.
Original (Chinese)
An apparatus comprising a package substrate, the package substrate comprising a glass layer, a first layer comprising a photo-imageable dielectric (PID) material above the glass layer, a second layer below the glass layer, the second layer comprising the PID material, at least one buildup layer above the first layer, and at least one buildup layer below the second layer.
External Resources