SEMICONDUCTOR DEVICE HAVING A POWER DISTRIBUTION LAYER
Dossier Overview
Applicant
SK hynix Inc.
Inventor
Jin Kyeong SEONG
IPC Classification
CPC Classification
A semiconductor device includes transistors disposed on a substrate; and interconnection layers disposed over the transistors. The interconnection layers include a lower interconnection layer and an upper interconnection layer disposed over the lower interconnection layer. The upper interconnection layer includes first patterns extending in parallel in a first direction; and second patterns disposed between the first patterns, and connecting the first patterns to each other in a second direction perpendicular to the first direction. The second patterns are arranged spaced apart from each other in the first direction, and arranged in a zigzag shape in the second direction.
Original (Chinese)
A semiconductor device includes transistors disposed on a substrate; and interconnection layers disposed over the transistors. The interconnection layers include a lower interconnection layer and an upper interconnection layer disposed over the lower interconnection layer. The upper interconnection layer includes first patterns extending in parallel in a first direction; and second patterns disposed between the first patterns, and connecting the first patterns to each other in a second direction perpendicular to the first direction. The second patterns are arranged spaced apart from each other in the first direction, and arranged in a zigzag shape in the second direction.
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