RECONSTITUTED GLASS PANEL FOR HYBRID PANEL MANUFACTURING
Dossier Overview
Applicant
Intel Corporation
Inventor
Yekan WANG; Andrew JIMENEZ; Zhixin XIE; Manohar KONCHADY; Srinivas Venkata Ramanuja PIETAMBARAM; Nirupama CHAKRAPANI; Jung Kyu HAN; Gang DUAN
IPC Classification
CPC Classification
Embodiments disclosed herein include an apparatus that comprises a first layer with a first surface, a second surface, and a sidewall surface that couples the first surface to the second surface. In an embodiment, the first layer comprises a glass layer. In an embodiment, a second layer is on the first surface, the second surface, and the sidewall surface of the first layer. In an embodiment, the second layer is an organic dielectric material. In an embodiment, a third layer is on the second layer, and the third layer is a metallic material. In an embodiment, an edge of the third layer is substantially coplanar with an edge of the second layer.
Original (Chinese)
Embodiments disclosed herein include an apparatus that comprises a first layer with a first surface, a second surface, and a sidewall surface that couples the first surface to the second surface. In an embodiment, the first layer comprises a glass layer. In an embodiment, a second layer is on the first surface, the second surface, and the sidewall surface of the first layer. In an embodiment, the second layer is an organic dielectric material. In an embodiment, a third layer is on the second layer, and the third layer is a metallic material. In an embodiment, an edge of the third layer is substantially coplanar with an edge of the second layer.
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